EKP-204 Black Silicone Potting Compound
Name
EKP-204 Black Silicone Potting CompoundProduct description
A professional two-component, room-temperature-curing compound for bulk potting, encapsulation and durable sealing of electrical and electronic products.
After mixing with the catalyst, it cures at room temperature to form a black elastic rubber-like mass that protects assemblies against moisture, vibration and UV radiation.
TDS
Our products
Black two-component RTV-2 compound for potting, encapsulation and durable sealing of electrical products.
Fields of application
- LED drivers, power supplies and junction boxes.
- Printed circuit boards, sensors, controllers and electromagnets.
- Industrial gaskets, seals and flexible moulds.
Benefits
- Uniform bulk cure in thick sections.
- High dielectric and electrical-insulation performance.
- Resistance to UV, weathering, vibration and mechanical loads.
- Resistance to oils, gasoline, ozone, oxidising agents and radiation.
- Convenient room-temperature curing.
Application methods
- Clean and degrease surfaces; thoroughly premix the base.
- Add 3–5 wt.% catalyst and mix for 3–5 minutes.
- Degas if required and pour into the prepared enclosure or mould.
Application
The allowable catalyst range is 1–7 wt.% and determines pot life and cure rate.
KHT catalyst is supplied separately.
Storage
Store in the tightly closed original container in accordance with the safety data sheet and certificate of analysis.
After the warranty period, use only after a successful trial mix.
Safety information
- Provide effective supply and exhaust ventilation.
- Wear gloves and safety glasses.
- Avoid contact with skin, eyes and the respiratory tract.
Physico-chemical properties
| Parameter | Value |
|---|---|
| Base appearance | Black viscous liquid; elastic mass after cure |
| Material type | Two-component RTV-2 silicone compound |
| Service temperature | −50 to +180 °C |
| Short-term peak temperature | up to +250 °C |
| Catalyst dosage | 3–5 wt.%; allowable range 1–7 wt.% |
| Pot life | 15–45 min |
| Onset of cure | 0.5–6 h |
| Demoulding | 24–48 h |
| Full cure | 72 h |